COM Express
COM Express, defined by the PCI Industrial Computer Manufacturers Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. ADLINK Technology is a key contributor to this standard, ensuring its robustness and reliability. COM Express employs a mezzanine-based approach, whereby an off-the-shelf module with two 220-pin board-to-board connectors plugs into a custom, application-specific carrier board.
The COM Express form factor defines mini-, compact-, basic-, and extended-size modules, each focusing on specific application areas and power envelopes. This versatile approach caters to a wide range of industries and technological needs, making COM Express an adaptable and future-proof solution.
About COM Express Type 6
The introduction of COM Express COM.0 Revision 3.1 enhances this popular Computer-on-Module form factor to meet the demands of current and future technologies. This update includes support for advanced interfaces such as PCI Express Gen 4 and USB 4, and introduces additional options like General Purpose SPI, MIPI-CSI, and SoundWire, making COM Express a versatile and forward-looking solution for diverse applications.
What is the COM Express Type 6?
COM Express Basic size Type 6 is the most popular and widely used computer-on-module form factor on the market. With pinouts closely matching the feature set of common x86 based silicon, two COM Express connectors allow for designs of up to 75 watts. The Type 6 pinout has a strong focus on multiple modern display outputs targeting applications such as medical, gaming, test and measurement and industrial automation.
The COM Express Compact Type 6 form factor is ideally suited to single chip x86 solutions (SoCs) with a power range between 5 to 20 watts. To reach this kind of low power envelopes peak performance and feature sets have been reduced compared to silicon used on the Basic size modules. Utilizing both Intel® Core™ and Atom® SoCs, Compact size modules are typically targeted at mid- and entry level applications such as transportation, robotics, edge servers, industrial control, and HMIs in the industrial and medical fields.
Type 6 Basic Size Modules
Express-RLP
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-ADP
COM Express Rev. 3.1 Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor
Express-TL
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-CFR
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CF/CFE
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 series and Intel Xeon® Processors
Express-KL/KLE
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors
Express-SL/SLE
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-BE
COM Express® Basic Size Type 6 Module with AMD Embedded R-Series APU (formerly codename: Bald Eagle)
Type 6 Compact Size Modules
cExpress-ASL
COM Express R3.1 Type 6 Compact size Module with x7000RE and x7000C Intel® Atom® Processors (Amston Lake)
cExpress-MTL
COM Express R3.1 Type 6 Compact size Module based on Intel® Core™ Ultra Processors
cExpress-ALN
COM Express R3.1 Type 6 Compact size Module with x7000 Intel® Atom® Processors (Alder Lake N)
cExpress-TL
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors
cExpress-AR
COM Express Compact Size Type 6 Module with AMD Ryzenâ„¢ Embedded V2000 APU (Zen 2 architecture)
cExpress-EL
COM Express Compact Size Type 6 Module with Intel Atom® x6000E Processor SoC (formerly codename: Elkhart Lake)
cExpress-WL
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-KL
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-AL
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-SL
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-BT
COM Express Compact Size Type 6 Module with Intel Atom® or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
Starter Kits
COM Express Type 6 Meteor Lake-H
COM Express Type 6 Prototyping Kit based on Intel® Core™ Ultra 5 Processor 125H
COM Express Type 6 Alder Lake-P
COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Raptor Lake-P
COM Express Type 6 Prototyping Kit based on Intel® 13th Gen Core™ i5-13600HE / i3-13300HE Processor
About COM Express Type 7
The COM Express Type 7 module, headless for server-level edge applications, boasts enhancements in the latest COM.0 Revision 3.1. Key upgrades include support for PCIe Gen4 with a second PCIe Clock for lanes 16-31 and updated 4x 10GbE to support CEI side-band signaling. This makes it a cutting-edge solution aligned with current and future technological advancements.
With the LAN PHY located on the carrier board, users can opt for 10GbE Copper or Fiber solutions. Type 7 supports up to 32 PCIe lanes and includes an NC-SI management interface. It accommodates a range of SoCs, from entry-level 2-core x86 processors to advanced 16-core processors, available in an extended operating temperature range of -40°C to 85°C.
Type 7 modules are versatile and suitable for a wide array of applications including general-purpose rugged embedded computers, mission-critical servers, SDN appliances, signal processing and data acquisition appliances, network test equipment, satellite gateways, and in-flight entertainment systems.
COM Express Type 7 Module
Express-VR7
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Ryzenâ„¢ Embedded V3000
Express-ID7
COM Express Rev. 3.1 Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor
Express-DN7
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-BD7
COM Express Basic Size Type 7 Module with Up to 16 cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD74
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Starter Kit
COM Express Type 7 Ryzen V3000
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What is the COM Express Type 10?
The COM Express Type 10 module is designed for low power platforms with a thermal design power (TDP) of 12W and below. It is perfect for compact handheld devices (smart battery) used in industrial, medical, transportation, and outdoor applications. With its compact Mini form factor (84 x 55 mm, equivalent to a credit card size), the Type 10 module delivers entry-level processing power with ultra-low power consumption. It supports graphics and an optimized I/O count tailored for mobile applications.
COM Express Type 10 Module
nanoX-EL
COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors
nanoX-AL
COM Express Mini Size Type 10 Module with Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly codename: Apollo Lake)
nanoX-BT
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
Starter Kit
COM Express Type 10 Elkhart Lake
COM Express Type 10 Development Kit based on Intel® 6th Gen Atom® x6211E Dual-core SoC