Type 7 Ryzen V3000 + IPMI – I-Pi SMARC

Type 7 Ryzen V3000 + IPMI

Product image of Type 7 Ryzen V3000 + IPMI

 

PRODUCT INFORMATION

IPMI featured Prototype Kit with AMD Embedded Ryzen V3000 in COM Express Basic Size Type 7 form factor offers best Performance/Watt in CPU computing and better remote/local manageability, making it ideal for edge network applications and edge servers. This configuration allows customers to create more compact, space-saving devices without compromising on performance.

BOX INCLUDING:

  • COM Express Basic Size Type 7 Module with AMD Embedded Ryzen V3000 (V3C18I) with MMC (Module Management Controller)

  • COM Express Type 7 R3.1 carrier board

  • AST2600 BMC based BMC module (RunBMC-AST2600)

  • Heatsink with active fan (THSF-VR7-B)

  • DB40-HPC debug board

  • Optional 10GbE Ethernet Adapter Card (SFP+ or 10GBASE-T)

  • PCIe x8-to-two-x4 adapter card

  • I/O bracket, cables and screws

SPECIFICATIONS:

The AMD Embedded Ryzen V3000 processor (V3C18I) offers 8 Cores,16 Threads at a power consumption of mere 15W, and supports up to 64GB (2x32GB) DDR5 memory at up to 4800MT/s. With its PCIe Gen4 and integrated 2x 10G Ethernet LAN and 1x 2.5G Ethernet LAN, it exhibits outstanding responsiveness, making it suitable for mission-critical applications requiring high-performance and low power consumption, such as edge networking equipment, 5G infrastructure at the edge, video analyses, intelligent surveillance, and industrial automation and control.

COM Express Type 7 Ryzen V3000 processor (V3C18I) could operate in an extended temperatures (-40°C to 85°C) at 15W TDP (10W configurable), combined with dual-channel ECC memory feature, fulfilling fanless designs across various harsh environments.

In addition, the BMC module, featuring the AST2600 processor, is readily available and serves as a crucial hardware and software building block designed to accelerate development time. By combining the Ryzen V3000 with the AST2600, products can be efficiently deployed across various environments.

HOW IT WORKS!

The COM Express Type 7 Ryzen V3000 + IPMI devkit consists of a simple carrier board paired with a COM Express module (based on PICMG COM.0 R3.1 specification) and a BMC module, a reference heatsink and an optional 10G Ethernet card (SFP+ or 10GBASE-T).

By combining the COM Express module with the reference heatsink and the carrier board and BMC module, and inserting the 10G Ethernet card along with a self-prepared DDR5 SO-DIMM memory into the carrier board, customers can jumpstart their ideas into prototypes for instant verification.

Modules are specifically designed for industrial embedded applications that require long life, high MTBF, and strict revision control.