Type 6 Panther Lake – I-Pi SMARC

Type 6 Panther Lake

Intel Core Ultra, high integration, less development complexity

 

PRODUCT INFORMATION

IoT Prototype Kit based on Intel® Core™ Ultra Series 3 Processor

BOX INCLUDING:

  • ADLINK Express-PTL COM Express Type 6 Basic size module with Intel Core Ultra Series 3 Processor 7X 358H / 7 356H (Panther Lake), supporting DDR5 SO-DIMM
  • Intel® Arc™ Xe3 Graphics up to 120 TOPS, Intel® NPU 5.0 up to 50 TOPS
  • ADLINK Express-BASE6 R3.1 carrier
  • THSF-PTL-B heatsink with active fan
  • Debug board (DB30 x86), with cables
  • Cable kit (SATA cable and Pin-header to DB9 adapter cable for COM port)

SPECIFICATIONS:

Intel Core Ultra X7 Processor 358H or 7 Processor 356H with 4x Performance-cores + 8x Efficient cores + 4x Low Power Efficient-cores, supporting up to 128GB DDR5 SO-DIMM memory up to 7200MHz, integrated Intel AI Boost NPU, powerful Intel® Arc™ B390 GPU with 12 Xe cores (358H) or Intel® Graphics GPU with 4 Xe cores (356H) graphics, supporting three display output through 2x USB4, and 1x DP, 1x PCIe Gen4 x8, 2x PCIe Gen4 x4, 1x 2.5GbE LAN, 8x PCIe Gen4 lanes, 4x USB 3.x/2.0/1.1, 2x USB 2.0/1.1, 2x SATA, 4x COM Port, and 8x GPIO and header for SMBUs/I2C

HOW IT WORKS

Accelerate the development of next-generation AI-powered embedded systems with the COM Express® Type 6 Panther Lake Development Kit. Built around a COM Express Computer-on-Module compliant with the PICMG COM.0 R3.1 specification, the kit combines a production-ready reference carrier board with ADLINK’s latest Intel® Core™ Ultra Series 3 (Panther Lake) module, providing a fast and efficient platform for proof-of-concept development, software validation, and application prototyping.

Powered by Intel® Core™ Ultra 7 358H or 7 356H processors with up to 16 hybrid CPU cores, integrated Intel® Arc™ graphics featuring up to 12 Xe cores, and Intel® NPU 5.0 delivering up to 50 TOPS of AI acceleration, the development kit is optimized for edge AI, machine vision, robotics, autonomous systems, industrial automation, medical devices, and intelligent IoT applications.

By leveraging an open-standard COM Express architecture, developers can reduce design complexity, shorten time-to-market, and seamlessly transition from prototype to production-ready embedded AI systems.