HOW IT WORKS
COM-HPC Server Type Ice Lake-D consists of a simple carrier paired with a COM-HPC Computer-on-Module.
The module features Intel Xeon D-2796 with 20 cores, PCIe Gen4 support, and 4x10GbE LAN, for Base-T or SFP+, offering exceptional connectivity for on-site prototyping and development of your communication and data processing solutions.
Modules are specifically designed for typical industrial embedded applications that require long life, high MTBF, and strict revision control.
COM-HPC Server Type Ice Lake-D
IoT Prototype Kit based on Intel Ice Lake-D
- COM-HPC-sIDH Server Type Size D with Intel® Xeon® D-2796 (Ice Lake-D)
- COM-HPC Server Base carrier
- THSF-sIDH BL heatsink with active fan
- VGA-to-HDMI cable
- I/O bracket
Intel Xeon D-2796 with 20 cores, providing 2x PCIe Gen4 x16, 2x PCIe Gen3 x4, 2x M.2 via PCIe, 4x 10GbE LAN (BASE-T/SFP+), 1x 2.5GbE LAN, 4x USB 3.x/2.0/1.1 (Rear), 2x extra USB 3.0 (Front_Panel), 2x SATA, 2x COM Port, 12x GPIO, and header for SMBUs/I2C
COM-HPC Modular Architecture
COM-HPC is the new PICMG standard for high-performance Computer-on-Modules. It aims to drive the newest breed of embedded edge servers with limitless scalability for today and tomorrow. The COM-HPC specification defines five different module sizes, with the largest Size E (Server Type) serving next-gen headless edge servers and accommodating up to 8 DIMMs.