COM Express Type 6 Raptor Lake-P
PRODUCT INFORMATION
IoT Prototype Kit based on Intel Raptor Lake-P, supporting PCIe Gen4 and 2x USB4
BOX INCLUDING:
- Express-RLP Com Express Type 6 Basic size with Intel® 13th Gen Core™ i5-13600HE / i3-13300HE (Raptor Lake-P), supporting DDR5 SO-DIMM
- Express Base 6 R3.1 carrier
- THSF-ADP-B heatsink with active fan
- Debug board (DB30 x86), with cables
- Cable kit (SATA cable and Pin-header to DB9 adapter cable for COM port)
SPECIFICATIONS:
Intel 13th Gen. hybrid-architecture Core™ i5-13600HE / i3-13300HE with 4/4x Performance cores and 8/4x Efficient cores, supporting up to 64GB DDR5 SO-DIMM memory, integrated with powerful Intel® Iris Xe graphics, supporting three display output through 2x USB4, and 1x DP, 1x PCIe Gen4 x8, 2x PCIe Gen4 x4, 1x 2.5GbE LAN, multiple PCIe Gen3 lanes, 4x USB 3.x/2.0/1.1, 2x USB 2.0/1.1, 2x SATA, 4x COM Port, and 8x GPIO and header for SMBUs/I2C
HOW IT WORKS
COM Express Type 6 Raptor Lake-P consists of a simple carrier paired with a COM-Express module (Computer-on-Module based on PICMG COM.0 R3.1 specification).
The module features Intel 13th Gen Core™ i5-13600HE / i3-13300HE, with Intel Iris Xe graphics integrated. By combining the reference heatsink with fan and carrier board within, along with a self-prepared DDR5 SO-DIMM memory, customers can prototype and verify their application ideas.
Modules are specifically designed for typical industrial embedded applications that require long life, high MTBF, and strict revision control.