COM-HPC
COM-HPC is the cutting-edge open standard for embedded computing modules designed to meet the demands of high-end IoT and edge server applications. With a variety of sizes and configurations, COM-HPC modules deliver server-class bandwidth, power, and performance. Since its ratification in 2021, COM-HPC solutions have been successfully deployed across numerous industries, showcasing their versatility and reliability.
COM-HPC Mini Type Modules
The COM-HPC specification add mini type at dimension of 95mm x 70mm in Rev 1.2. It addresses a need seen for a smaller form factor, lower power envelope and lower cost at single 400-pin connector. A single power rail input with 8 to 20-volt range deliver up to 107 watts of power and there are 16x lanes PCIe Gen5 in total.
The COM-HPC Mini type modules deliver robust computing power that rivals full-sized counterparts. They are engineered for efficiency, with advanced ruggedness, thermal management and energy-saving features. Like COM-HPC Server and Client type, COM-HPC Mini supports high-bandwidth interfaces including USB 4.0, Thunderbolt, 16 PCIe Gen 5 lanes, and 10 Gbit/s Ethernet. However, the reduced pin count necessitates pin sharing for some functions. At the same time, the Mini form factor adds some interfaces that are common in small form factor applications, such as a CAN bus, SGMII ports. The Mini also adjusts many I/O voltage rails from 3.3V to 1.8V for lower power consumption and increased efficiency. The use of soldered memory ensures ruggedness, accommodating the form factor’s smaller size and reduced stack height.
These modules are the perfect solution for space-constrained applications, offering the latest in high-speed interfaces and multi-core processing capabilities. The range of applications for COM-HPC Mini type modules is very broad: medical equipment, test & measurement, compact rugged embedded servers, transportation systems and more.
COM-HPC Mini Type Module
Starter Kits
Mini Type Meteor Lake
COM-HPC Mini Prototyping Kit based on Intel® Core™ Ultra 5 Processor 125H/125U
Mini Type Panther Lake
COM-HPC Mini Prototyping Kit based on Intel® Core™ X7 Processor 358H/368H
COM-HPC Client Type Modules
The COM-HPC specification defines three client modules: Size A (95mm x 120mm), Size B (120mm x 120mm), and Size C (160mm x 120mm). The largest client module, Size C, offers up to four on-board SO-DIMM sockets and a single 12-volt power supply that can deliver up to 251 watts. It also features 49x lanes of PCIe Gen5 in total. These client modules are designed for high-end embedded client products, needing one or more displays, a full set of low, medium, and very high bandwidth I/O for fast data transfer, powerful CPUs, and modest size.
While the standard primarily focuses on x86 implementations, it supports traditional x86 systems and power-efficent CPU architectures like ARM64, enhancing performance and energy efficiency for specialized modules. The applications for COM-HPC client modules are diverse, including medical equipment, test & measurement, rugged embedded computers, transportation systems, and more.
Explore the powerful capabilities of COM-HPC modules and find the perfect solution for your high-performance embedded computing needs.
COM-HPC Client Type Module
COM-HPC-cRLS
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC Server Type Modules
COM-HPC offers two server module types, including the largest, Size E (200mm x 160mm), which features up to eight on-board DIMM sockets. The modules have a single 12-volt power supply capable of delivering up to 358 watts and support 64x lanes of PCIe Gen5. Additionally, COM-HPC server modules support the Intelligent Platform Management Bus (IPMB) and the Intelligent Platform Management Interface (IPMI), providing management and monitoring capabilities independently of the host system's CPU, firmware, and operating system. These modules are ideal for a range of applications, such as general-purpose rugged embedded computers, mission-critical servers, stationary and mobile robotics, medical imaging and robotic surgery, test and measurement, and autonomous driving.
COM-HPC Server Type Module
COM-HPC-sIDH
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-ALT
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
Arm Development Platform
Ampere Altra Developer Platform
COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Ampere Altra Developer Rugged
Rugged COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Starter Kits
COM-HPC Server Type Ice Lake-D Starter Kit
Starter Kit for COM-HPC-sIDH
Ampere Altra Dev Kit
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC