PRODUCT INFORMATION
COM-HPC Mini Prototyping Kit based on Intel® Core™ Ultra X7 Processor 356H/358H
BOX INCLUDING:
- COM-HPC-mPTL COM-HPC Mini size with Intel® Core™ Ultra 7 356H or X7 358H (Panther Lake-H)
- 16GB LPDDR5X soldered memory
- Intel® Arc™ Xe3 Graphics up to 120 TOPS, Intel® NPU 5.0 up to 50 TOPS
- COM-HPC Mini R1.2 carrier board
- THSF-mPTL-B heatsink with active fan
- Cable for UART headers
SPECIFICATIONS:
Intel Core Ultra (X)7 Processor 356H/358H with up to 4x Performance-cores, 8x Efficient-cores and 4x Low Power Efficient-cores, 16GB LPDDR5X soldered memory, integrated Intel® NPU 5.0 up to 50 TOPS, Intel® Arc™ Xe3 Graphics up to 120 TOPS supporting up to four display outputs through 1x DP, 1x HDMI, and 2x eDP Alternative mode at USB4 Type C , 1x PCIe Gen5 x2 at M.2 M-key connector for NVMe SSD, 2x PCIe Gen5 x4 at a x8 slot, additional 1x PCIe Gen4 x4 at a x4 slot, 2x 2.5GbE LAN, 2x USB 3.x/2.0, 2x USB 2.0, up to 4x COM ports, and headers for 8x GPIO, SMBUs and I2C. An optional BGA-type NVMe SSD on the COM-HPC module is available for discussion on a case-by-case basis.
Note: Storage, and power supply not included.
TERMS & CONDITIONS
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