Type 6 Panther Lake Dev Kit
インテルCore Ultraにより、システム統合性が向上し、開発負荷を軽減
PRODUCT INFORMATION
This Development Kit is based on the Intel® Core™ Ultra Series 3 Processor and is ideal for all types of edge-embedded applications. Leveraging a heterogeneous architecture (integrated CPU, GPU, and NPU), it is perfectly suited for edge AI workloads that require running multiple AI models simultaneously. Additionally, a dedicated extended-temperature SKU allows the product to be deployed reliably across a wide range of harsh environments.
BOX INCLUDING:
- Express-PTL COM Express Type 6 basic size module with Intel® Core™ Ultra Processor 358H/356H, supporting DDR5 SODIMM and CSODIMM
- Express-BASE6 R3.1 carrier
- THSF-PTL-B, heatsink with active fan
- Debug board (DB30 x86) with cables
- Cable kit (SATA cable and Pin-header to DB9 adapter cable for COM port)
SPECIFICATIONS:
Intel Core Ultra Series 3 Processor 356H/358H with 4x Performance cores, 8x Efficient cores and 4x Low power Efficient cores, supporting up to 96GB DDR5 SO-DIMM memory, powerful Intel® Xe3 cores-based graphics, supporting three display output through 1x DP and optional 2x USB4. Rich I/O includes 1x PCIe Gen4 x8, 1x PCIe Gen4 x4 and another 3x PCIe x1, 1x 2.5GbE LAN, up to 4x SATA, 4x USB 3.x/2.0/1.1, 2x USB 2.0/1.1, 4x COM Port, and 8x GPIO and header for SMBUs/I2C.
In addition, Intel Core Ultra Series 3 Processor 358H processor delivers up to 180 TOPS via integrated Intel NPU 5.0 AI accelerator and powerful 12Xe integrated GPU.
HOW IT WORKS
Accelerate the development of next-generation AI-powered embedded systems with the COM Express® Type 6 Panther Lake Development Kit. Built around a COM Express Computer-on-Module compliant with the PICMG COM.0 R3.1 specification, the kit combines a reference carrier board with ADLINK’s latest Intel® Core™ Ultra Series 3 (Panther Lake) module, providing a fast and efficient platform for proof-of-concept development, software validation, and application prototyping.
Powered by Intel® Core™ Ultra 7 358H or 7 356H processors with up to 16 hybrid CPU cores, integrated Intel® Arc™ graphics featuring up to 12 Xe cores, and Intel® NPU 5.0 delivering total up to 180 TOPS, the development kit is optimized for edge AI, machine vision, robotics, autonomous systems, industrial automation, medical devices, and intelligent IoT applications.
By leveraging an open-standard COM Express architecture, developers can reduce design complexity, shorten time-to-market, and seamlessly transition from prototype to production-ready embedded AI systems.