Mini Type Panther Lake
PRODUCT INFORMATION
IoT Prototype Kit based on Intel® Core™ Ultra X7 Processor 356H/358H
BOX INCLUDING:
- ADLINK COM-HPC-mPTL COM-HPC Mini size with Intel® Core™ Ultra X7 356H/358H (Panther Lake-H)
- 16GB LPDDR5X soldered memory
- Intel® Arc™ Xe3 Graphics up to 120 TOPS, Intel® NPU 5.0 up to 50 TOPS
- ADLINK COM-HPC Mini R1.2 carrier board
- THSF-mPTL-B heatsink with active fan
- Cable for UART headers
SPECIFICATIONS:
Intel Core Ultra X7 Processor 356H/358H with up to 4x Performance-cores, 8x Efficient-cores and 4x Low Power Efficient-cores, 16GB LPDDR5X soldered memory, integrated Intel® NPU 5.0 up to 50 TOPS, Intel® Arc™ Xe3 Graphics up to 120 TOPS supporting up to four display output through 1x DP, 1x HDMI, and 2x eDP Alternative mode at USB4 Type C , 1x PCIe Gen5 x2 at M.2 M-key connector for NVMe SSD, 2x PCIe Gen5 x4 at a x8 slot, additional 1x PCIe Gen4 x4 at a x4 slot, 2x 2.5GbE LAN, 2x USB 3.x/2.0, 2x USB 2.0, up to 4x COM ports, and headers for 8x GPIO, SMBUs and I2C. An optional BGA-type NVMe SSD on the COM-HPC module is available for discussion on a case-by-case basis.
HOW IT WORKS
The ADLINK Mini Type Panther Lake physical AI development kit pairs a simple carrier board with a COM-HPC Mini module, a Computer-on-Module built to the PICMG COM-HPC R1.3 specification. The module features the Intel® Core™ Ultra X6 Processor 356H / 358H, with integrated Intel® Arc™ Xe3 Graphics delivering up to 120 TOPS, Intel® NPU 5.0 delivering up to 50 TOPS, extensive high-speed interfaces, and a TDP of only 25W.
Whether you are building compact, intelligent edge solutions for graphics-intensive or AI-driven industrial IoT applications, or looking to reduce system complexity, this devkit is the ideal starting point for your proof of concept. ADLINK modules are designed specifically for edge AI and embedded applications that demand long product life, high MTBF, and strict revision control, giving you a stable, dependable foundation from prototype through long-term deployment.