Modular Edge Computing for Autonomous Mobile Robots & Humanoid Platforms
Compact Intelligence for Complex Robotics — Built for Rapid Innovation
Next-generation mobile robots and humanoid robotics platforms require a tightly integrated edge computing architecture capable of running AI perception, computer vision, SLAM, sensor fusion, autonomous navigation, motion planning, and real-time motor control simultaneously within strict power and thermal limits. These advanced robotics workloads demand heterogeneous processing—combining high-performance CPU and GPU resources for AI inference with deterministic, low-latency control for robotics actuators and safety systems. In this mobile robotics application, the developer’s legacy COM Express module became a performance bottleneck, lacking the high-speed I/O bandwidth, AI accelerator scalability, and thermal efficiency required to support modern autonomous mobile robot (AMR) and humanoid robot autonomy stacks.
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Generalized humanoid diagram
The system architecture was redefined using ADLINK’s COM-HPC and SMARC computer-on-modules, paired with an MXM GPU for AI and vision acceleration. The COM-HPC module serves as the primary compute node, providing high core-count CPUs, large DDR5 memory capacity, and PCIe Gen5 connectivity to support GPU-accelerated perception and planning pipelines. Complementary SMARC modules handle distributed I/O, sensor aggregation, and auxiliary control tasks at significantly lower power, reducing load on the main compute node. This modular partitioning enables scalable performance, improved thermal management, and simplified upgrades as compute or AI requirements evolve—while maintaining industrial-grade reliability and long-term availability required for robotics systems deployed in real-world environments.
The Robotics Pivot Point: Performance, TDP, and Time-to-Market
As the developer advanced toward its next-generation humanoid prototype, four mission-critical challenges emerged:
- Thermal constraints: Intensive AI workloads packed into a confined robotic torso risked overheating, throttling, or system instability.
- Escalating compute and I/O requirements: Their previous COM Express platform could no longer handle next-level vision, sensor fusion, or high-speed actuation demands, making COM-HPC migration essential.
- Relentless market pressure: In a space defined by rapid iteration and aggressive competition, even minor delays could result in lost market footing.
- Industrial-grade reliability expectations: Robots in real-world environments require 24/7 stability and long-term availability, ensuring the compute platform remains available and serviceable throughout the robot’s lifecycle — with no exception.
ADLINK: A Development Partner Driving Speed, Reliability, and Scale
Designed to Adapt — Modular Flexibility That Protects Your Roadmap
- Custom BIOS and firmware optimization
- MXM GPU module integration optimized for AI and vision processing
- Tailored carrier board designs
- High-speed I/O mapping for advanced sensors and peripherals
- Thermal tuning matched to unique mechanical constraints
Engineering Expertise That Shrinks Your Schedule
ADLINK doesn’t just ship hardware — they become part of your development team. Their engineering team provides hands-on support from concept to deployment, including:
- Early schematic and PCB layout reviews
- On-site troubleshooting and rapid iteration
- Custom BIOS and firmware development
- Reference designs and off-the-shelf development kits that shorten integration time
- System-level validation of CPU, MXM GPU, and thermal performance under real-world AI workloads
This collaborative approach removes common integration bottlenecks and keeps ambitious deadlines on track. The result: faster prototyping, shorter validation cycles, and a smoother path to market.
Cost-Effective Today, Scalable for Tomorrow
By building on ADLINK’s off-the-shelf COM-HPC and SMARC modules, robotics innovators avoid the complexity and expense of developing a custom CPU board from scratch. Combined with competitive pricing and flexible business terms, ADLINK delivers:
- Reduced engineering overhead
- Lower development and lifecycle risk
- Faster time-to-production
- A scalable compute foundation for future generations
It’s a solution that delivers high-end performance now while preserving long-term design flexibility.
A Blueprint for Robotics Innovators Everywhere
This collaboration shows how forward-thinking teams — across humanoid robotics, mobile autonomy, and industrial AI — can leverage ADLINK’s compute platforms to stay ahead of surging performance demands and tightening market windows.
Core advantages include:
- High-performance AI compute for real-time autonomy
- Scalable CPU + MXM GPU acceleration for vision and AI workloads
- Ruggedized 24/7 reliability for harsh environments
- Up to 10 years of longevity support (5 for GPU) for predictable lifecycle planning
- Modular architecture that scales with future requirements
- Faster development enabled by hands-on engineering support
- Reduced cost and risk through off-the-shelf compute solutions
From Prototype to Production — With a Partner Built for Robotics Innovation
Whether building humanoid robots, autonomous mobile systems, or next-generation industrial AI platforms, ADLINK’s COM-HPC, SMARC, and MXM GPU modules offer the performance, stability, and scalability needed to move from concept to market with confidence.
With ADLINK’s engineering collaboration, thermal optimization expertise, design flexibility, and long-term product availability, innovators can focus on creating intelligent robotic systems that redefine what machines can do.
Accelerate your next breakthrough with ADLINK’s COM-HPC, SMARC and MXM solutions.